Ct detector module and heat dissipation structure

ABSTRACT

A detector module is provided. The detector module may include a plurality of detector sub-modules. Each of the plurality of detector sub-modules may include a detection layer, at least one data acquisition circuitry, a frame for supporting the detection layer, and a positioning element for assembling the plurality of detector sub-modules. The frame may include a plurality of heat transfer fins that are thermally connected with the at least one data acquisition circuitry for dissipating heat produced by the at least one data acquisition circuitry.

CROSS-REFERENCE TO RELATED APPLICATIONS

The application is a continuation of International Application No.PCT/CN2017/100659, filed on Sep. 6, 2017, the contents of which areincorporated herein by reference.

TECHNICAL FIELD

The present disclosure generally relates to an imaging apparatus, andmore particularly, to a CT detector module with a heat dissipationstructure.

BACKGROUND

A detector module in a computed tomography (CT) device may be used forreceiving radiation emitted by a CT tube and converting the radiationinto digital signals for image processing. The detector module mayinclude a photodetector, a data acquisition circuitry, a scintillator,etc. During operation, an analog-to-digital converter (ADC) on the dataacquisition circuitry may produce considerable heat, which may interferewith the performance of the photodetector, the scintillator, etc.Accordingly, it would be desirable to provide a heat dissipationstructure to reduce the heat produced by the detector module.

SUMMARY

Additional features will be set forth in part in the description whichfollows, and in part will become apparent to those skilled in the artupon examination of the following and the accompanying drawings or maybe learned by production or operation of the examples. The features ofthe present disclosure may be realized and attained by practice or useof various aspects of the methodologies, instrumentalities andcombinations set forth in the detailed examples discussed below.

According to an aspect of the present disclosure, a detector module isprovided. The detector module may include a plurality of detectorsub-modules. The plurality of detector sub-modules may include a firstdetector sub-module and a second detector sub-module adjacent to thefirst detector sub-module. The plurality of detector sub-modules may bedetachably assembled. The first detector sub-module may include a firstpositioning element, and the second detector sub-module may include asecond positioning element. Each of the plurality of detectorsub-modules may include a detection layer to detect radiation and atleast one data acquisition circuitry that is electrically connected withthe detection layer. The at least one data acquisition circuitry may beconfigured to process an electrical signal in response to the radiationdetected by the detection layer. A detector sub-module may furtherinclude a frame that supports the detection layer and the at least onedata acquisition circuitry. The first positioning element and the secondpositioning element may form a mating connection.

In some embodiments, the first positioning element of the first detectorsub-module may include a boss disposed on a first side of the detectorsub-module. The second positioning element of the second detectorsub-module may include a recessed pocket disposed on a second side ofthe second detector sub-module. The second side of the second detectorsub-module may be situated to face the first side of the first detectorsub-module.

In some embodiments, the plurality of detector sub-modules may beassembled based on a bolt inserted through the boss and the recessedpocket.

In some embodiments, a detector sub-module of the plurality of detectorsub-modules may further include a plurality of fins that may bethermally connected with the at least one data acquisition circuitry ofthe detector sub-module.

In some embodiments, the plurality of fins of the detector sub-modulemay be disposed on a third side of the frame. The data acquisitioncircuitry may be disposed on a fourth side of the frame. The fourth sidemay be opposite to the third side.

In some embodiments, the at least one data acquisition circuitry may beelectrically connected with two signal transmission boards disposed onopposite sides of the frame. The two signal transmission boards may beelectrically connected to the detection layer of the detectorsub-module.

In some embodiments, the at least one data acquisition circuitry may beelectrically connected with a signal transmission board that may bedisposed on a same side of the frame as the at least one dataacquisition circuitry.

In some embodiments, the plurality of fins may be disposed on oppositesides of the frame.

In some embodiments, the detector sub-module may include two dataacquisition circuitries that may be disposed on opposite sides of theframe of the detector sub-module.

In some embodiments, the detector sub-module may include two signaltransmission boards that may be disposed on opposite sides of the frame.Each of the two signal transmission boards may be electrically connectedwith one of the two data acquisition circuitries.

In some embodiments, the frame may be configured to support ananti-scatter grid that may be disposed on a top of the detection layer.

According to another aspect of the present disclosure, a detector moduleis provided. The detector module may include a frame and a detectionlayer supported by the frame. The detection layer may be configured todetect radiation. The detector module may further include at least onedata acquisition circuitry that is electrically connected with thedetection layer. The at least one data acquisition circuitry may beconfigured to process an electrical signal in response to the radiationdetected by the detection layer. The detector module may further includea dissipation structure which includes a plurality of fins that may bethermally coupled with the at least one data acquisition circuitry.

In some embodiments, the plurality of fins may be disposed on a firstside of the frame. The at least one data acquisition circuitry may bedisposed on a second side of the frame. The first side may be oppositeto the second side.

In some embodiments, the at least one data acquisition circuitry may beelectrically connected with a first signal transmission board that maybe disposed on a same side of the frame as the at least one dataacquisition circuitry. The first signal transmission board may beelectrically connected to the detection layer of the detector module.

In some embodiments, the at least one data acquisition circuitry may beelectrically connected with a second signal transmission board that maybe disposed on a same side of the frame as the plurality of fins. Thesecond signal transmission board may be electrically connected to thedetection layer of the detector module.

In some embodiments, a first portion of the plurality of fins may bedisposed on a third side of the frame. A second portion of the pluralityof fins may be disposed on a fourth side of the frame. The third sidemay be opposite to the fourth side.

In some embodiments, the at least one data acquisition circuitry may bedisposed on the third side or the fourth side of the frame.

In some embodiments, the at least one data acquisition circuitry mayinclude a first data acquisition circuitry and a second data acquisitioncircuitry. The first data acquisition circuitry may be disposed on thethird side of the frame. The second data acquisition circuitry may bedisposed on the fourth side of the frame.

In some embodiments, the first data acquisition circuitry may beelectrically connected with a third signal transmission board disposedon a same side of the frame as the first data acquisition circuitry. Thesecond data acquisition circuitry may be electrically connected with afourth signal transmission board that may be disposed on a same side ofthe frame as the second data acquisition circuitry.

In some embodiments, the detector module may further include a recessedpocket disposed on the frame. The recessed pocket may be configured toreceive a boss of another detector module to assemble the detectormodule and the other detector module.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure is further described in terms of exemplaryembodiments. These exemplary embodiments are described in detail withreference to the drawings. These embodiments are non-limiting examples,in which like reference numerals represent similar structures throughoutthe several views of the drawings, and wherein:

FIG. 1 is a schematic block diagram of an exemplary imaging systemaccording to some embodiments of the present disclosure;

FIG. 2 is a schematic structure of an imaging apparatus according tosome embodiments of the present disclosure;

FIG. 3 illustrates a perspective view of an exemplary detector moduleaccording to some embodiments of the present disclosure;

FIG. 4 illustrates a perspective view of an exemplary anti-scatter gridmodule of a detector module according to some embodiments of the presentdisclosure;

FIG. 5 illustrates a perspective view of a detector sub-module accordingto some embodiments of the present disclosure;

FIG. 6 illustrates a perspective view of another detector sub-moduleaccording to some embodiments of the present disclosure;

FIGS. 7A and 7B are perspective views of a portion of a detectorsub-module according to some embodiments of the present disclosure;

FIG. 8 illustrates a perspective view of an exemplary detector moduleaccording to some embodiments of the present disclosure;

FIG. 9 illustrates a perspective view of an exemplary detector moduleaccording to some embodiments of the present disclosure;

FIG. 10 illustrates a perspective view of an exemplary detector moduleaccording to some embodiments of the present disclosure;

FIGS. 11A and 11B illustrate perspective views of an exemplary detectorsub-module according to some embodiments of the present disclosure;

FIGS. 12A and 12B illustrate a perspective view and a side view of anexemplary detector sub-module according to some embodiments of thepresent disclosure;

FIGS. 13A and 13B illustrate a perspective view and a side view of anexemplary detector sub-module according to some embodiments of thepresent disclosure; and

FIG. 14 is a perspective view of a detection unit according to someembodiments of the present disclosure.

DETAILED DESCRIPTION

In the following detailed description, numerous specific details are setforth by way of examples in order to provide a thorough understanding ofthe relevant disclosure. However, it should be apparent to those skilledin the art that the present disclosure may be practiced without suchdetails. In other instances, well-known methods, procedures, systems,components, and/or circuitry have been described at a relativelyhigh-level, without detail, in order to avoid unnecessarily obscuringaspects of the present disclosure. Various modifications to thedisclosed embodiments will be readily apparent to those skilled in theart, and the general principles defined herein may be applied to otherembodiments and applications without departing from the spirits andscope of the present disclosure. Thus, the present disclosure is notlimited to the embodiments shown, but to be accorded the widest scopeconsistent with the claims.

It will be understood that the term “system,” “unit,” “module,” and/or“block” used herein are one method to distinguish different components,elements, parts, section or assembly of different level in ascendingorder. However, the terms may be displaced by another expression if theymay achieve the same purpose.

It will be understood that when a unit, module or block is referred toas being “on,” “connected to” or “coupled to” another unit, module, orblock, it may be directly on, connected or coupled to the other unit,module, or block, or intervening unit, module, or block may be present,unless the context clearly indicates otherwise. As used herein, the term“and/or” includes any and all combinations of one or more of theassociated listed items.

The terminology used herein is for the purposes of describing particularexamples and embodiments only, and is not intended to be limiting. Asused herein, the singular forms “a,” “an,” and “the” may be intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “include,”and/or “comprise,” when used in this disclosure, specify the presence ofintegers, devices, behaviors, stated features, steps, elements,operations, and/or components, but do not exclude the presence oraddition of one or more other integers, devices, behaviors, features,steps, elements, operations, components, and/or groups thereof.

FIG. 1 is a schematic block diagram of an exemplary imaging system 100according to some embodiments of the present disclosure. As shown, theimaging system 100 may include an imaging apparatus 102, a dataacquisition module 104, an image reconstruction module 106, a console108, a controller 110, and a storage device 112. It should be noted thatthe imaging system described below is merely provided for illustrationpurposes, and not intended to limit the scope of the present disclosure.The imaging system 100 may find its applications in various fields, suchas healthcare industries (e.g., medical applications), securityapplications, industrial applications, etc. For example, the imagingsystem 100 may be used for internal inspections of components including,e.g., flaw detection, security scanning, failure analysis, metrology,assembly analysis, void analysis, wall thickness analysis, or the like,or a combination thereof. The imaging system may be a computedtomography (CT) system, a digital radiography (DR) system, a computedradiography (CR) scanner, a multi-modality system, or the like, or acombination thereof.

The imaging apparatus 102 may be a computed tomography (CT) scanner, adigital radiography (DR) scanner, a computed radiography (CR) scanner,amulti-modality imaging device, or the like, or a combination thereof.Exemplary multi-modality imaging devices may include a computedtomography-positron emission tomography (CT-PET) scanner, a computedtomography-magnetic resonance imaging (CT-MRI) scanner, etc. The imagingapparatus 102 may generate a signal by scanning an object with radiationbeams. The radiation beams may include a photon ray. The photon ray mayinclude an X-ray, a γ-ray, ultraviolet, laser, or the like, or acombination thereof. The object may include a substance, a tissue, anorgan, a specimen, a body, a human being, or the like, or a combinationthereof. The signal may be an optical signal such as a visible lightsignal containing characteristic information of the object, such asdensity, thickness, composition, etc. In some embodiments, a detector inthe imaging apparatus 102 may detect a radiation beam traversing anobject to generate a signal. For example, the detected radiation beammay excite a scintillating material on the detector to generate avisible light signal.

The data acquisition module 104 may obtain a signal generated by theimaging apparatus 102. For example, the data acquisition module 104 mayreceive a light signal from the imaging apparatus 102. The light signalmay be generated by radiation beams from the imaging apparatus 102. Atleast a portion of the radiation beams may have traversed the objectbefore being detected. The data acquisition module 104 may include anoptoelectronic conversion unit, an analog-digital converter (ADC), orthe like, or a combination thereof. The optoelectronic conversion unitmay convert the light signal into an electronic signal. Theanalog-digital converter may convert the electronic signal into adigital signal, such as a digital signal encoding projection data. Theprojection data may be transmitted to the image reconstruction module106. It should be noted that, in some embodiments, the optoelectronicconversion unit and/or the analog-digital converter may be unnecessary,or may be integrated into the imaging apparatus 102.

The image reconstruction module 106 may generate an image based on datarelating to an object obtained from the data acquisition module 104, orthe storage device 112. The data relating to the object may includeprojection data corresponding to radiation beams traversing the object.The image may be generated using a suitable analytical, an iterative,and/or other reconstruction techniques. The image reconstruction module106 may be connected to or communicate with the data acquisition 104,the console 108, the controller 110, and the storage 112 via a wirelessconnection, a wired connection, or a combination thereof.

The console 108 may be a user interface through which a user or anoperator may communicate with different components in the imaging system100. The console 108 may include an input device, a control panel, etc.The input device may include alphanumeric and other keys that may beinput via a keyboard, a touch screen (for example, with a haptics ortactile feedback), a speech input, an eye tracking input, a brainmonitoring system, or any other comparable input mechanism. The inputdevice may also include, for example, a cursor control device, such as amouse, a trackball, or cursor direction keys, etc. The console 108 maydisplay images generated by the image reconstruction module 106. Theconsole 108 may send a command or an instruction from a user or anoperator to the image reconstruction module 106, and/or the controller110. The console 108 may set one or more parameters for the imagingsystem 100, including acquisition parameters and/or reconstructionparameters. The acquisition parameters may relate to one or moreconditions in obtaining scan data by, for example, scanning an object.The reconstruction parameters may relate to one or more conditions inreconstructing an image of the object. For example, the acquisitionparameters may include a tube voltage, a tube current, recon parameters(e.g., a slice thickness), a scan time, a collimation/slice width, abeam filtration, a helical pitch, etc. The reconstruction parameters mayinclude a reconstruction field of view (FOV), a reconstruction matrix, aconvolution kernel/reconstruction filter, etc.

The controller 110 may control the imaging apparatus 102, the dataacquisition module 104, the image reconstruction module 106, the console108, and/or the storage device 112. For example, the controller 110 maycontrol the imaging apparatus 102 to rotate to a desired position thatmay be prescribed by a user via the console 108. The controller 110 maycontrol the parameters of radiation beams, including the intensity ofradiation beams. As another example, the controller 110 may control thedisplay of images on the console 108. In some embodiments, thecontroller 110 may control the data acquisition module 104 to acquire asignal generated from the imaging apparatus 102. Furthermore, thecontroller 110 may control the image reconstruction module 106 togenerate an image based on data received from the data acquisitionmodule 104.

The controller 110 may include a processor, a processing core, a memory,or the like, or a combination thereof. Specifically, the controller 110may include a central processing unit (CPU), an application-specificintegrated circuit (ASIC), an application-specific instruction-setprocessor (ASIP), a graphics processing unit (GPU), a physics processingunit (PPU), a digital signal processor (DSP), a field-programmable gatearray (FPGA), a programmable logic device (PLD), a microcontroller unit,a microprocessor, an advanced RISC machines processor (ARM), or thelike, or a combination thereof.

The storage device 112 may store data relating to the imaging system100. The data may be a numerical value, an image, information of asubject, an instruction and/or a signal to operate the imaging apparatus102, voice, a model relating to a patient, an algorithm relating to animage processing technique, or the like, or a combination thereof.Exemplary numerical values may include a threshold, a CT value, a valuerelating to an anti-scatter grid, or the like, or a combination thereof.Exemplary images may include a raw image or a processed image (e.g., animage after pretreatment). Exemplary models relating to a patient mayinclude the background information of the patient, such as, ethnicity,citizenship, religion, gender, age, matrimony state, height, weight,medical history (e.g., history relating to different organs, ortissues), job, personal habits, or the like, or a combination thereof.

The storage device 112 may include a random access memory (RAM), aread-only memory (ROM), or the like, or a combination thereof. Therandom access memory (RAM) may include a dekatron, a dynamic randomaccess memory (DRAM), a static random access memory (SRAM), a thyristorrandom access memory (T-RAM), a zero capacitor random access memory(Z-RAM), or the like, or a combination thereof. The read only memory(ROM) may include a bubble memory, a magnetic button line memory, amemory thin film, a magnetic plate line memory, a core memory, amagnetic drum memory, a CD-ROM drive, a hard disk, a flash memory, orthe like, or a combination thereof. The storage device 112 may be aremovable storage device such as a U flash disk that may read data fromand/or write data to the image reconstruction module 106 in a certainmanner. The storage device 112 may also include other similar means forproviding computer programs or other instructions to operate themodules/units in the imaging system 100. The storage device 112 may beoperationally connected with one or more virtual storage resources(e.g., a cloud storage, a virtual private network, other virtual storageresources, etc.) for transmitting or storing the data into the one ormore virtual storage resources.

In some embodiments, the imaging system 100 may be connected to anetwork (not shown in the figure). The network may be a local areanetwork (LAN), a wide area network (WAN), a public network, a privatenetwork, a proprietary network, a public switched telephone network(PSTN), the Internet, a virtual network, a metropolitan area network, atelephone network, or the like, or a combination thereof. The connectionbetween different components in the imaging system 100 may be wired orwireless. The wired connection may include using a metal cable, anoptical cable, a hybrid cable, an interface, or the like, or acombination thereof. The wireless connection may include using awireless local area network (WLAN), a wireless wide area network (WWAN),a Bluetooth, a ZigBee, a near field communication (NFC), or the like, ora combination thereof.

This description is intended to be illustrative, and not to limit thescope of the present disclosure. Many alternatives, modifications, andvariations will be apparent to those skilled in the art. The features,structures, methods, and other characteristics of the exemplaryembodiments described herein may be combined in various ways to obtainadditional and/or alternative exemplary embodiments. For example, thestorage device 112 may be a database including cloud computingplatforms, such as a public cloud, a private cloud, a community andhybrid clouds, etc. As another example, the data acquisition module 104may be implemented on the imaging apparatus 102. As a further example,the controller 110 and the storage device 112 may be integrated into onemodule. However, those variations and modifications do not depart thescope of the present disclosure.

FIG. 2 is a schematic structure of an imaging apparatus 200 according tosome embodiments of the present disclosure. As shown, the imagingapparatus 200 may include a radiation source 202, an anti-scatter gridarray 206, and a detector module 208.

The radiation source 202 may generate and emit radiation beams travelingtoward an object 204. The radiation beams may include, for example,primary radiation beams 210 and secondary radiation beams 212 as shownin FIG. 2. A primary radiation beam 210 may refer to a radiation beamthat travels along a substantially straight axis or direct trajectorybetween the radiation source 202 and the detector module 208. Asecondary radiation beam 212 may refer to a radiation beam that isscattered or deflected while traversing the object 204 located in thepathway of the radition beam from the radiation source 202 to thedetector module 208. The secondary radiation beams 212 may strike thedetector module 208 at an angle relative to their original path(s) fromthe radiation source 202. In some embodiments, a secondary radiationbeam 212 may also be referred to as a scattered radiation beam. Whilethe primary radiation beams 210 are useful for generating an image ofthe object 204 under examination, the secondary radiation beams 212 maycause artifacts in the image.

The radiation source 202 may include a tube, such as a cold cathode iontube, a high vacuum hot cathode tube, a rotating anode tube, etc. Thetube may be powered by a high voltage generator. The tube may emitradiation beams toward the object 204 and/or the detector module 208.The detector module 208 may detect radiation beams passing throughapertures in the imaging apparatus 200 defined by, for example, theanti-scatter grid array 206. Merely by way of example, the radiationbeams may include X-rays, as described elsewhere in the disclosure. Theobject 204 may include a substance, a tissue, an organ, a specimen, abody, a human being, or the like, or a combination thereof as describedelsewhere in the disclosure. The shape of the radiation beams emitted bythe radiation source 202 may be a line, a pencil, a fan, a cone, awedge, an irregular shape, or the like, or a combination thereof.

The anti-scatter grid array 206 may absorb scattered radiation. Forexample, the anti-scatter grid array 206 may absorb the secondaryradiation beams 212 and/or alter directions of the secondary radiationbeams 212, while allowing the primary radiation beams 210 to passthrough the anti-scatter grid array 206. The types of radiation mayinclude, for example, electromagnetic radiation, particle radiation,etc. The anti-scatter grid array 206 may include a material that canabsorb one or more types of radiation (also referred to herein as a“highly absorbing material”). Exemplary highly absorbing materials mayinclude tungsten, lead, uranium, gold, silver, copper, molybdenum, etc.The anti-scatter grid array 206 may also include a material that canallow one or more types of radiation to pass (also referred to herein asa “poorly absorbing material”). For example, the poorly-absorbingmaterial may allow passage of essentially all radiation striking on thematerial. As used herein, “essentially all” may indicate that at least50%, or at least 60%, or at least 70%, or at least 80%, or at least 90%,or at least 95% of the radiation striking on the poorly absorbingmaterial may pass through. As another example, the poorly absorbingmaterials may be substantially non-absorbent of certain radiation. Forinstance, all or a certain amount of the radiation striking on a poorlyabsorbing material may pass through the material. Merely by way ofexample, at least 50%, or at least 60%, or at least 70%, or at least80%, or at least 90%, or at least 95% of the radiation striking on thepoorly absorbing material may pass through the material. Examples of thepoorly absorbing materials may include resin, a fibrous material,rubber, an inorganic non-metallic material (e.g., ceramics), etc. Theresin may include thermoplastic resin or thermosetting resin. Thethermosetting resin may include phenolic resin, urea-formaldehyde resin,melamine-formaldehyde resin, epoxy resin, unsaturated resin,polyurethane, polyimide, etc. The thermoplastic resin may includepolymethyl methacrylate (PMMA), acrylonitrile butadiene styrene (ABS),polyamide, polylactic acid (PLA), polybenzimidazole (PBI), polycarbonate(PC), polyethersulfone (PES), polyetheretherketone (PEEK), polyethylene(PE), polyphenylene oxide (PPO), polyphenylene sulfide (PPS),polypropylene (PP), polystyrene (PS), polyvinyl chloride (PVC), etc. Thefibrous material may include an inorganic fibrous material, an organicfibrous material, or the like, or a combination thereof. Exemplaryinorganic fibrous material may include glass fibers, carbon fibers,boron fibers, whisker, asbestos fibers, silicon carbide fibers, etc.Organic fibers may include synthetic fibers including, for examplearamid fibers, polyester fibers, nylon fibers, vinylon fibers,polypropylene fibers, polyimide fibers, etc., and natural fiber (e.g.,cotton, sisal, paper) etc. The rubber may include butyl rubber,chlorinated rubber, nitrile rubber, etc.

A highly absorbing material and a poorly absorbing material may absorbdifferent amounts of radiation. For example, the highly absorbingmaterial may absorb a greater amount of radiation than the poorlyabsorbing material. The highly absorbing material(s) and/or the poorlyabsorbing material(s) may be positioned in the anti-scatter grid array206 to absorb scattered radiation. For example, plates made of thehighly absorbing materials may be positioned parallel to and/orsubstantially parallel to paths of radiation beams from the radiationsource 202 to the detector module 208. The highly absorbing materialsmay absorb scattered radiation beams (e.g. secondary radiation beams212). The poorly absorbing material may allow primary radiation beams(e.g., primary radiation beams 210) to pass through the anti-scattergrid array 206.

In some embodiments, the anti-scatter grid array 206 may be placedbetween the radiation source 202 and the detector module 208. Theanti-scatter grid array 206 may be coupled to the detector module 208.For example, the anti-scatter array grid 206 may be coupled to thedetector module 208 by bonding, gluing, taping, welding, etc. One ormore fasteners may be used to connect the anti-scatter grid array 206 tothe detector module 208. Exemplary fasteners may include a rivet, abolt, a pin joint, a key joint, or the like, or a combination thereof.

The shape of the anti-scatter grid array 206 may be flat, arc-shaped,circular, linear, or the like, or a combination thereof. Examples of theanti-scatter grid array 206 may include a focused grid (e.g., anarc-focused grid), a linear grid, a crossed grid, a parallel grid, orthe like, or a combination thereof. In some embodiments, theanti-scatter grid array 206 may include a specific configuration definedby one or more parameters, such as a focal length, a grid ratio, a griddensity, etc. For example, a highly absorbing material may be configuredas a plate. The focal length may refer to a perpendicular distance fromthe focal point to the upper surface of the anti-scatter grid array 206.The focal point of the anti-scatter grid array 206 may be a point atwhich a plurality of plates of the anti-scatter grid array 206 meet. Theplates of the highly absorbing material(s) may be placed at variouspositions based on the focal length of anti-scatter grid 206. In someembodiments, an offset angle of a plate of the anti-scatter grid arrary206 may be determined. The offset angle of a plate may be set such thatthe primary radiation beams 210 is not blocked by the plate, while thesecondary radiation beams 212 may be blocked by or strike the plate. Theoffset angle may be defined as an angle between a path of a primaryradiation beam 210 emitted from the radiation source 202 and the normalline that is perpendicular to the upper surface of the anti-scatter grid206. The grid ratio may be a ratio of the height of the plate to aninterspace between adjacent plates.

In some embodiments, the anti-scatter grid array 206 may include one ormore anti-scatter grid modules. Each anti-scatter grid module may be afocused grid, a rectilinear grid, a crossed grid, an arc grid, aparallel grid, or the like, or a combination thereof. Each anti-scattergrid module may be in a specific configuration defined by one or moreparameters, including a focal length, a grid ratio, a grid density, etc.In some embodiments, the anti-scatter grid modules of the anti-scattergrid array 206 may have the same configuration defined by the sameparameters. In some embodiments, at least some of the anti-scatter gridmodules may have different configurations defined by differentparameters. In some embodiments, the anti-scatter grid modules mayattach to each other by bonding, gluing, taping, welding, etc. In someembodiments, one or more fasteners may be used to connect theanti-scatter grid array 206 to the detector module 208. Exemplaryfasteners may include a rivet, a bolt, a pin joint, a key joint, or thelike, or a combination thereof.

The detector module 208 may detect radiation beams traversing the object204. The detector module 208 may include one or more detectorsub-modules. In some embodiments, a plurality of detector sub-modules ofthe detector module 208 may be positioned to form an arcuate structure.A detector sub-module may include a plurality of pixels. A pixel mayrefer to the smallest unit in the detector module 208 that may detectradiation beams. One or more detector sub-modules may be detachablyassembled to form the detector module 208. The width of the detectormodule 208 may be the sum of the width of each detector sub-module ofthe detector module 208. The number of the detector sub-modules may befixed or adjustable according to different conditions including, forexample, a desired resolution of an image, a desired size of an image,the size of an object, the sensitivity of the detector sub-modules, themechanical stability of the detector sub-modules, or the like, or acombination thereof.

The detector module 208 may have any suitable shape. For example, theshape of the detector module 208 may be flat, arc-shaped, circular, orthe like, or a combination thereof. The fan angle of an arc-shapeddetector module may have any suitable value. The fan angle may be in therange from 0° to 360°, from 30° to 270°, from 45° to 300°, etc. The fanangle of the arc-shaped detector may be above 30°. The fan angle of thearc-shaped detector may be above 45°. The fan angle of the arc-shapeddetector may be one of 45°, 60°, 75°, 90°, or 105°.

The detector module 208 may include a detection layer. The detectionlayer may include, e.g., a scintillator layer and a photodiode array.The scintillator layer may generate a visible light when detecting aradiation beam. The photodiode array may convert the visible light intoan electrical signal. The scintillator layer may include a plurality ofscintillators disposed in a matrix form in a plane. For example, adetector sub-module may include a matrix of 32×64 scintillators. Thephotodiode array may include a plurality of photodiodes disposed in amatrix form in a plane parallel to and/or substantially parallel to theplane of the scintillator layer. As used herein, “substantiallyparallel” may indicate that the angle between the plane formed by thephotodiode array and the plane of the scintillator layer is close tozero, e.g., less than 60 degrees, or less than 50 degrees, or less than40 degrees, or less than 30 degrees, or less than 20 degrees, or lessthan 10 degrees, or less than 5 degrees. For example, a detectorsub-module may include a matrix of 32×64 photodiodes. In someembodiments, the detector layer may convert the radiation beamsimpinging thereon into an electrical signal directly by a suitablematerial, such as amorphous selenium.

The detector module 208 may include at least one data acquisitioncircuitry that may process the electrical signal received from the arrayof photodiodes. For example, the at least one data acquisition circuitrymay convert the electrical signal to a digital signal for furtherprocessing. In some embodiments, the at least one data acquisitioncircuitry may be electrically connected with a portion of the detectormodule 208, such as a portion of or all the plurality of photodiodes ofthe detector module 208. For example, the plurality of photodiodes ofthe detector module 208 may be electrically connected with the at leastone data acquisition circuitry through one or more signal transmissionboards. The number of the plurality of signal transmission boardsconnected to a data acquisition circuitry may be fixed or adjustableaccording to different conditions including, for example, the heatdissipation need, the ambient temperature, the sensitivity of thedetector sub-modules, the stability of the detector sub-modules, or thelike, or a combination thereof.

The detector module 208 may include a frame that supports the detectionlayer and the data acquisition circuitry. The frame may have anysuitable shape and/or dimension. For example, the cross-section of theframe may have the shape of a rectangle, a trapezoid, a polygon, or anyother regular or irregular shape. In some embodiments, the frame mayhave a shape like a capital T as illustrated in FIGS. 13A and 13B. Theframe may have a base part that is physically attached to the detectionlayer, and a columnar part that is perpendicular to and/or substantiallyperpendicular to the base part. As used herein, “substantiallyperpendicular” may indicate that the angle between the column part andthe base part is close to 90 degrees or the deviation (from 90 degrees)is less than 50 degrees, or less than 40 degrees, or less than 30degrees, or less than 20 degrees, or less than 10 degrees, or less than5 degrees. In some embodiments, different frames of different detectorsub-modules may be attached to each other to form a detector module. Forinstance, the frames of any two neighboring detector sub-modules areattached to each other by way of, for example, bonding, gluing, taping,welding, fasteners, or the like, or a combination thereof. In someembodiments, the frames of different detector sub-modules may be mountedon a supporting structure, such as a baseboard. The supporting structuremay hold different detector sub-modules together to form a detectormodule.

The detector module 208 may include a plurality of heat transfer fins tofacilitate the dissipation of the heat produced by the detection layer,and/or the at least one electrical circuitry attached to the detectionlayer.

This description is intended to be illustrative, and not to limit thescope of the present disclosure. Many alternatives, modifications, andvariations will be apparent to those skilled in the art. The features,structures, methods, and other characteristics of the exemplaryembodiments described herein may be combined in various ways to obtainadditional and/or alternative exemplary embodiments. For instance, theanti-scatter grid array 206 may be an integrated part of the detectormodule 208. However, those variations and modifications do not departthe scope of the present disclosure.

FIG. 3 illustrates a perspective view of an exemplary detector moduleaccording to some embodiments of the present disclosure. As shown, thedetector module 300 may include an anti-scatter grid 301, a bolt 310, athreaded fastener 330, a first detector sub-module 350 a, a seconddetector sub-module 350 b, and a third detector sub-module 350 c. Theanti-scatter grid 301 may be located at the top of the detector module300. The first detector sub-module 350 a may be located at one end ofthe detector module 300, e.g., the front end of the detector module 300as shown in FIG. 3. The third detector sub-module 350 c may be locatedat another end of the detector module 300, e.g., the rear end of thedetector module 300 as shown in FIG. 3. The second detector sub-module350 b may be located between the first detector sub-module 350 a and thethird detector sub-module 350 c. The bolt 310 may be inserted throughthe first detector sub-module 350 a, the second detector sub-module 350b, and the third detector sub-module 350 c.

In some embodiments, the anti-scatter grid 301 may include a highlyabsorbing material as described in connection with FIG. 2. In someembodiments, the anti-scatter grid 301 may be made of a polymer-basedcomposite material including high-density particles of one or morehighly absorbing materials that can absorb radiation. In someembodiments, the anti-scatter grid 301 may be made of an alloy includingat least one highly absorbing material. In some embodiments, the widthof the anti-scatter grid 301 may be the same as the width w₂ of thedetector module, e.g., one side of the anti-scatter grid 301 aligns withthe corresponding side of the first detector sub-module 350 a, and theopposing side of the anti-scatter grid 301 aligns with the correspondingside of the third detector sub-module 350 c as shown in FIG. 3. Thewidth w₂ of the detector module may be the sum of the widths of eachdetector sub-module that forms the detector module, e.g., the firstdetector sub-module 350 a, the second detector sub-module 350 b, and thethird detector sub-module 350 c.

In some embodiments, a detector sub-module may include a detectionlayer, a data acquisition circuitry, a plurality of signal transmissionboards, a frame, and a plurality of heat transfer fins as described inconnection with FIG. 2. The width of a detector sub-module, e.g., thewidth w₁ of the second detector sub-module 350 b, may be equal to orsmaller than the width of the detection layer. In some embodiments, thewidths of different detector sub-modules may be the same or different.For example, the width of the detector sub-module located at an end ofthe detector module (e.g., the first detector sub-module 350 a, thethird detector sub-module 350 b) may be the same as or different fromthe width of the detector sub-module located in the middle portion ofthe detector module (e.g., the second detector sub-module 350 b).

The threaded fastener 330 may be used to mount the anti-scatter grid 301on the top of the detector sub-modules, as described in connection withthe threaded fastener 430 in FIG. 4.

A sub-module may include components that are used to, for example,connect to another detector sub-module, and/or process a signalgenerated in response to impinged radiation beams. For illustrationpurposes, the structure of the first detector sub-module 350 a isdescribed as an example. The first detector sub-module 350 a may includea detection layer (not shown in FIG. 3), a plurality of signaltransmission boards 302 (eight signal transmission boards 302 are shownin FIG. 3 for illustration purposes), and a data acquisition circuitry303. Radiation beams that pass through the anti-scatter grid 301 mayimpinge on the dection layer where an electrical signal may be generatedin response. The plurality of signal transmission boards 302, eachconnecting to a portion of the detection layer, may transmit theelectrical signal from corresponding portions of the detection layer tothe data acquisition circuitry 303. The data acquisition circuitry 303may process the electrical signals, such as convert the electricalsignals to digital signals for further processing. Furthermore, thefirst detector sub-module 350 a may include a frame 304 that supportsthe detection layer, the anti-scatter grid 301, the data acquisitioncircuitry 303, etc. The frame 304 may include a positioning elementconfigured to facilitate the assembling of the detector module 300. Forinstance, a first frame of two neighboring (or adjacent) frames 304 mayinclude a boss (or protrusion), while a second frame of the twoneighboring frames 304 may include a recessed pocket that iscomplementary to the boss of the first frame such that the twoneighboring frames 304 may be attached to each other by insert the bossinto the recessed pocket. As used herein, a boss may be consideredcomplementary to a recessed pocket if the boss and the recessed pocketmay form a mating connection (the boss may be also referred to as maleconnector, and the recessed pocket may be also referred to as femaleconnector). Merely by way of example, the recessed pocket of the seconddetector sub-module 350 b may receive the boss of the first detectorsub-module 350 a. Then, the first detector sub-module 305 a and thesecond detector sub-module 305 b may be assembled by inserting the bolt310 through the hole defined in the boss of the first detectorsub-module 350 a and the corresponding hole defined in the recessedpocket of the second detector sub-module 350 b. The bolt 310 may befurther fastened by a nut.

It shall be noted that any two adjacent detector sub-modules may beassembled via a boss of one detector sub-module and a recessed pocket ofthe other detector sub-module. In some embodiments, the detectorsub-modules at an end of the detector module may include at least one ofa boss and a recessed pocket. For example, the first detector sub-module350 a may at least include a boss that is complementary to a recessedpocket of the second detector sub-module 350 b. The third detectorsub-module 350 c may at least include a recessed pocket that iscomplementary to a boss of the second detector sub-module 350 b. Thedetector sub-module in the middle of the detector module may at leastinclude a pair of the boss and the recessed pocket, each located on aside of the detector sub-module that faces an adjacent detectorsub-module, respectively. For instance, the detector sub-module 350 bmay include a recessed pocket on the one side facing the first detectorsub-module 350 a, and a boss on the opposite side facing the thirddetector sub-module 350 c.

In some embodiments, the boss and/or recessed pocket may be replaced byother structures that may facilitate assembly (e.g., facilitatealignment and/or attachment) of the detector sub-modules. For example,the detector sub-modules may be assembled by fixing the detectorsub-modules on one or more baseboards.

In some embodiments, different alignment techniques may be used in theassembling of a detector module. For example, a first alignmenttechnique, e.g., using aligning structures, may be used to assemble afirst pair of adjacent detector sub-modules, and a second alignmenttechnique, e.g., bonding via a glue layer, may be used to assemble asecond pair of adjacent detector sub-modules. In some embodiments, theglue layer may be distributed between the two adjacent detectorsub-modules uniformly to keep the adjacent detector sub-modules contactas close as possible. In some embodiments, the glue layer may be appliednon-uniformly or only to a portion of the surfaces where the adjacentdetector sub-modules meet.

This description is intended to be illustrative, and not to limit thescope of the present disclosure. Many alternatives, modifications, andvariations will be apparent to those skilled in the art. The features,structures, methods, and other characteristics of the exemplaryembodiments described herein may be combined in various ways to obtainadditional and/or alternative exemplary embodiments. In someembodiments, the anti-scatter grid 301 may be assembled by a pluralityof anti-scatter sub-grids. Each of the anti-scatter sub-grids maycorrespond to a detector sub-module. However, those variations andmodifications do not depart the scope of the present disclosure.

FIG. 4 illustrates a perspective view of an exemplary detector moduleaccording to some embodiments of the present disclosure. As shown, thedetector module 400 may include an anti-scatter grid 401, a detectionlayer 406, a bolt 410, an anti-scatter grid supporting block 420, athreaded fastener 430, an alignment pin 440, a first detector sub-module450 a, a second detector sub-module 450 b, and a third detectorsub-module 450 c. The first detector sub-module 450 a may include aplurality of signal transmission boards 402, a frame 404, and aplurality of heat transfer fins 405.

The anti-scatter grid 401 may include a plurality of anti-scatterplates. The anti-scatter plates may include a highly absorbing materialthat absorbs one or more types of radiation. A pair of adjacentanti-scatter plates may be spaced by an interspace. The interspacebetween two adjacent plates may be filled with air or a poorly absorbingmaterial. In some embodiments, the anti-scatter grid plates of theanti-scatter grid 401 may be equally spaced.

The anti-scatter grid supporting block 420 may provide a sidewall forthe anti-scatter grid 401. The anti-scatter grid supporting block 420may include a poorly absorbing material that can allow one or more typesof radiation to pass (e.g., X-rays, alpha rays, etc.).

The bolt 410 may be used to assemble the detector module 400 asdescribed elsewhere in the disclosure. See, for example, the bolt 310described in connection with FIG. 3.

Radiation beams that pass through the anti-scatter grid 401 may impingeon the detection layer 406. Details regarding the detection layer may befound elsewhere in the disclosure. See, for example, the detection layer606 described in connection with FIG. 6.

The threaded fastener 430 may be used to fix the anti-scatter grid 401on the frame(s) of the first detector sub-module 450 a, the seconddetector sub-module 450 b, and/or the third detector sub-module 450 c.The threaded fastener 430 may be inserted through the anti-scatter grid401 and at least partially into the frame(s) of the first detectorsub-module 450 a, the second detector sub-module 450 b, and/or the thirddetector sub-module 450 c. In some embodiments, the threaded fastener430 may be part of a rivet structure, a key joint, a pin joint, and/orany other fastening mechanism.

The alignment pins 440 may be used to align the anti-scatter grid 401with the first detector sub-module 450 a, the second detector sub-module450 b, and/or the third detector sub-module 450 c. In some embodiments,the alignment pin 440 may be inserted into a pin hole on the frame of adetector sub-module, such as pin hole 507 as illustrated in FIG. 5.

This description is intended to be illustrative, and not to limit thescope of the present disclosure. Many alternatives, modifications, andvariations will be apparent to those skilled in the art. The features,structures, methods, and other characteristics of the exemplaryembodiments described herein may be combined in various ways to obtainadditional and/or alternative exemplary embodiments. For example, theanti-scatter grid 401 may be assembled based on a plurality ofanti-scatter sub-grids, and the assembled anti-scatter grid 401 may befurther connected to the detector sub-modules. However, those variationsand modifications do not depart the scope of the present disclosure.

FIG. 5 illustrates a perspective view of a detector sub-module accordingto some embodiments of the present disclosure. As shown, the detectorsub-module 500 may include a plurality of signal transmission boards502, a data acquisition circuitry 503, a frame 504, a plurality of heattransfer fins 505, a detection layer 506, a pin hole 507, a plurality ofthreaded holes 520, a first recessed pocket 508, and a second recessedpocket 518. In some embodiments, the detector sub-module may be thefirst detector sub-module, the second detector sub-module, or the thirddetector sub-module as described in connection with FIG. 3.

The plurality of signal transmission boards 502 may be configured totransmit electrical signals received from the detection layer 506 to thedata acquisition circuitry 503. As shown in FIG. 5, each of theplurality of signal transmission boards 502 may be electricallyconnected with a different portion of the detection layer 506. Theelectrical signals from each of the plurality of signal transmissionboards 502 may be processed by the data acquisition circuitry 503. Insome embodiments, the plurality of signal transmission boards 502 may belocated on the same side of the data acquisition circuitry 503. Anelectrical connection between a signal transmission board 502 and thedata acquisition circuitry 503 may be formed. See, e.g., relevantdescription of FIGS. 7A and 7B. In some embodiments, the plurality ofsignal transmission boards 502 may be located on different sides of thedata acquisition circuitry 503. See, for example, the signaltransmission boards 1202 a and 1202 b in FIG. 12B. In some embodiments,the plurality of signal transmission boards 502 may include a circuitprinted on a flexible plastic substrate, such as polyimide, transparentconductive polyester film, etc.

The data acquisition circuitry 503 may be configured to process theelectrical signal from the plurality of signal transmission boards 502.In some embodiments, the data acquisition circuitry 503 may be fixed onthe frame 504 by bonding, gluing, taping, welding, etc. In someembodiments, the data acquisition circuitry 503 and the frame 504 may beconnected using any suitable fastener, such as rivets, bolts, bolts,pins joints, key joints, or the like, or a combination thereof.

The frame 504 may be configured to support the components of thedetector sub-module 500, such as the data acquisition circuitry 503, thedetection layer 506, etc. The frame 504 may have any suitable shapeand/or dimension. For example, the cross-section of the frame may have ashape of a rectangle, a trapezoid, a polygon, or any other regular orirregular shape. In some embodiments, the frame may have a shape like acapital T as described in connection with FIGS. 13A and 13B. The framemay have a base part that is attached to the detection layer 506, and acolumnar part that is perpendicular to and/or substantiallyperpendicular to the base part. The columnar part may be disposed at oneside of the base part as described in connection with FIG. 5, or may bedisposed in the middle of the base part as described in FIGS. 13A and13B.

The plurality of heat transfer fins 505, forming a heat dissipationstructure, may be thermally connected or coupled with one or more otherparts of the detector sub-module 500A. As used herein, that a firststructure is thermally connected or coupled with a second structure mayindicate that heat may transfer between the first structure and thesecond structure. In some embodiments, the plurality of heat transferfins 505 may facilitate the dissipation of the heat produced by the dataacquisition circuitry 503 and/or the detection layer 506. The pluralityof heat transfer fins 505 may be disposed on one or more sides of theframe 504. For example, the plurality of heat transfer fins 505 may bedisposed on a same side of the columnar part of the frame 504, as shownin FIG. 5. As another example, the plurality of heat transfer fins 505may be disposed on opposite sides of the frame 504. See, for example,heat transfer fins 1305 a and 1305 b in FIG. 13A and 13B. The pluralityof heat transfer fins 505 may be evenly or unevenly arranged along thecolumnar part of the frame 504. In some embodiments, an interspacebetween two heat transfer fins may be filled with air. In someembodiments, an interspace between two heat transfer fins may be filledwith an effective heat dissipation material. In some embodiments, aninterspace between two heat transfer fins may be filled partially withair and partially with an effective heat dissipation material. Exemplaryeffective heat dissipation materials may include an alloy, a carbonfiber, a graphite, a thermal conductive adhesive, a thermally conductivegrease, etc. In some embodiments, the plurality of heat transfer fins505 may form an integral part of the frame 504. For example, thetransfer fins 505 and the frame 504 may be manufactured together as aone-piece or integral component. As another example, the transfer fins505 may be welded to the frames 504. In some embodiments, the pluralityof heat transfer fins 505 may be mounted on the frame via a mechanicallyconnection. For example, the plurality of heat transfer fins 505 may befixed on the frame 504 using a bolt. As another example, the pluralityof heat transfer fins 505 may be inserted into one or more slots in theframe 504.

A heat transfer fin 505 may have any suitable shape and/or dimension.For example, the cross-section of a heat transfer fin 505 may have theshape of a rectangle, a trapezoid, a polygon, or any other regular orirregular shape. In some embodiments, the plurality of heat transferfins 505 may be arranged in a manner that each fin may form an anglewith respect to, for example, the horizontal line. In some embodiments,the heat transfer fins may be parallel to and/or substantially parallelto each other. As used herein, “substantially parallel” may indicatethat the angle between the heat transfer fins is close to zero, e.g.,less than 60 degrees, or less than 50 degrees, or less than 40 degrees,or less than 30 degrees, or less than 20 degrees, or less than 10degrees, or less than 5 degrees.

The detection layer 506 may include a scintillator layer and aphotodetector layer. The scintillator layer may convert the radiationbeams into an optical signal. The photodetector layer may include aplurality of photodiodes that convert the optical signal into anelectrical signal.

The plurality of pin holes 507 may be configured to align the frame 504with an anti-scatter grid as described in FIG. 4. The plurality of pinholes 507 may be configured to receive one or more alignment pins thatpass through the sidewalls of the anti-scatter grid as described inconnection with FIG. 4. A pin hole 507 may have any suitable shapeand/or dimension. For example, a pin hole 507 may have the shape of acircle, an ellipse, a hexagon or any other regular or irregular shape.

The first recessed pocket 508 and/or the second recessed pocket 518 maybe configured to align the detector sub-module with another detectorsub-module. The other detector sub-module may have a complementarypositioning element, such as a boss. The shape of a boss may becomplementary to the shape of the first recessed pocket 508 and/or thesecond recessed pocket 518. For example, the first recessed pocket 508and/or the second recessed pocket 518 may be configured to facilitatethe alignment and/or attachment between the second detector sub-module350 b and the third detector sub-module 350 c as described in connectionwith FIG. 3.

The first recessed pocket 508 and/or the second recessed pocket 518 mayhave any suitable shape and/or dimension. For example, the cross-sectionof the first recessed pocket 508 and/or the second recessed pocket 518may have the shape of a rectangle, a trapezoid, a polygon, a circle, anellipse, or any other irregular shape. There may be one or more holes inthe first recessed pocket 508 and/or the second recessed pocket 518. Afastener (e.g., a bolt) may be inserted into such a hole to facilitatethe assembly of a plurality of detector sub-modules.

In some embodiments, there may be any suitable number of recessedpockets in a frame. Merely by way of example, there may be two recessedpockets located in a frame. The first recessed pocket 508 may be locatedon one side of the frame, and the second recessed pocket 518 may belocated on the opposite side of the frame as illustrated in FIG. 5.

The plurality of threaded holes 520 may be configured to assemble theframe 504 and an anti-scatter grid as described in FIG. 4. The pluralityof threaded holes 520 may be configured to receive one or more threadedfasteners as described in connection with FIG. 4. A threaded hole 520may have any suitable shape and/or dimension. For example, thecross-section of a threaded hole 520 may have the shape of a circle, anellipse, a hexagon or any other regular or irregular shape.

This description is intended to be illustrative, and not to limit thescope of the present disclosure. Many alternatives, modifications, andvariations will be apparent to those skilled in the art. The features,structures, methods, and other characteristics of the exemplaryembodiments described herein may be combined in various ways to obtainadditional and/or alternative exemplary embodiments. For example, thedetection layer 506 may be disposed at the top of the frame 504 by wayof bonding, gluing, taping, welding, a fastener, or the like, or acombination thereof. However, those variations and modifications do notdepart the scope of the present disclosure.

FIG. 6 illustrates a perspective view of a detector sub-module 600according to some embodiments of the present disclosure. As shown, thedetector sub-module 600 may include a frame 604, a plurality of heattransfer fins 605, a detection layer 606, a pin hole 607, a first boss609, a second boss 619, and a plurality of threaded holes 620. The frame604, the plurality of heat transfer fins 605, the detection layer 606,the pin hole 607, and the plurality of threaded holes 620 may be similarto the frame 504, the plurality of heat transfer fins 505, the detectionlayer 506, the pin hole 507, and the plurality of threaded holes 520,and the description is not repeated here.

In some embodiments, the detector sub-module 600 may correspond to thefirst detector sub-module, the second detector sub-module, or the thirddetector sub-module as described in FIG. 3. The first boss 609 and/orthe second boss 619 may have any suitable shape and/or dimension. Forexample, the cross-section of the first boss 609 and/or the second boss619 may have the shape of a rectangle, a trapezoid, a polygon, a circle,an ellipse, or any other irregular shape. The shape of the first boss609 may be complementary to the shape of a recessed pocket, such as thefirst recessed pocket 508 of another detector sub-module. There may beone or more holes in the first boss 609 and/or the second boss 619. Afastener (e.g., a bolt) may be inserted into such a hole to facilitatethe assembly of a plurality of detector sub-modules.

In some embodiments, there may be any suitable number of bosses on aframe. Merely by way of example, there may be two bosses located on aframe. The first boss 609 may be located on one side of the frame andthe second boss 619 may be located on the opposite side of the frame asillustrated in FIG. 6. The number of bosses on a detector sub-module maybe same with the number of recessed pockets on another detectorsub-module that is attached to the detector sub-module.

This description is intended to be illustrative, and not to limit thescope of the present disclosure. Many alternatives, modifications, andvariations will be apparent to those skilled in the art. The features,structures, methods, and other characteristics of the exemplaryembodiments described herein may be combined in various ways to obtainadditional and/or alternative exemplary embodiments. For example, thedetection layer 606 may be connected to an anti-scatter grid by a gluelayer, a rivet, or the like, or a combination thereof. However, thosevariations and modifications do not depart the scope of the presentdisclosure.

FIGS. 7A and 7B are perspective views of a portion of a detectorsub-module according to some embodiments of the present disclosure. Asshown, a detection layer 706 may be electrically connected to a signaltransmission board 702. The signal transmission board 702 may be furtherelectrically connected to a data acquisition circuitry 703.

The detection layer 706 may include a plurality of pixels. A pixel mayinclude a scintillator and a photodetector. The plurality of pixels maybe disposed in a matrix form. Merely by way of example, the detectionlayer 706 may include a matrix of 64×512 pixels. The 64×512 pixels maybe divided into 16 groups of pixels, each of which may include 32×64pixels. The 16 groups of pixels may be arranged in two rows so that eachrow may have 8 groups of pixels. In some embodiments, a group of pixelsmay be connected to a signal transmission board, e.g., the signaltransmission board 702. In some embodiments, two or more groups of thepixels may be connected to a same signal transmission board.

As shown in FIG. 7B, the plurality of signal transmission boards,including the signal transmission board 702, may be disposed on a sameside of the data acquisition circuitry 703. It shall be noted that theplurality of signal transmission boards may be disposed on differentsides of the data acquisition circuitry 703, including the front sideand the rear side. The number of signal transmission boards 702 locatedon each side may be the same or different.

This description is intended to be illustrative, and not to limit thescope of the present disclosure. Many alternatives, modifications, andvariations will be apparent to those skilled in the art. The features,structures, methods, and other characteristics of the exemplaryembodiments described herein may be combined in various ways to obtainadditional and/or alternative exemplary embodiments. For example, thedetection layer 706 may be connected to an anti-scatter grid by a gluelayer, a rivet, or the like, or a combination thereof. However, thosevariations and modifications do not depart the scope of the presentdisclosure.

FIG. 8 illustrates a perspective view of an exemplary detector module800 according to some embodiments of the present disclosure. As shown,the detector module 800 may include an anti-scatter grid 801, analignment pin 840, a plurality of threaded fasteners 830, and a detectorsub-module 850 d. The detector sub-module 850 d may include a frame 804,a plurality of heat transfer fins 815, a plurality of signaltransmission boards 802, and a data acquisition circuitry 803.

A detection layer may be electrically connected with the dataacquisition circuitry 803 via the plurality of signal transmissionboards 802. The alignment pin 840 and the plurality of threadedfasteners 830 may be used to assemble the anti-scatter grid 801 and thedetector sub-module 850 d together. The plurality of heat transfer fins815 may be disposed on two sides of the columnar part of the frame 804.In some embodiments, the heat transfer fins may be symmetrically orasymmetrically arranged on the two sides of the columnar part of theframe 804. The number of heat transfer fins on each side of the columnarpart of the frame 804 may be the same or different. In some embodiments,the data acquisition circuitry 803 may include a data acquisitioncircuitry that is thermally connected with the heat transfer fins 815 onone side of the columnar part of the frame 804. In some embodiments, thedata acquisition circuitry 803 may include two data acquisitioncircuitries. The two data acquisition circuitries may be thermallyconnected with the heat transfer fins 815 arranged on different sides ofthe columnar part 804, respectively.

This description is intended to be illustrative, and not to limit thescope of the present disclosure. Many alternatives, modifications, andvariations will be apparent to those skilled in the art. The features,structures, methods, and other characteristics of the exemplaryembodiments described herein may be combined in various ways to obtainadditional and/or alternative exemplary embodiments. For example, thedetector sub-module 850 d may be connected to the anti-scatter grid 801by a glue layer, a rivet, or the like, or a combination thereof.However, those variations and modifications do not depart the scope ofthe present disclosure.

FIG. 9 illustrates a perspective view of an exemplary detector module900 according to some embodiments of the present disclosure. As shown,the detector module 900 may include an anti-scatter grid 901, a bolt910, a plurality of threaded fasteners 930, a first detector sub-module950 a, and a second detector sub-module 950 c. Each of the firstdetector sub-module 950 a and the second detector sub-module 950 c mayinclude a frame 904, a plurality of heat transfer fins 905, a pluralityof signal transmission boards 902, and a data acquisition circuitry 903.The plurality of heat transfer fins 905 may be located on one side ofthe frame 904. The anti-scatter grid 901 may be located at the top ofthe detector module 900. The detector module 900 may be assembled byinserting the bolt 910 through the first detector sub-module 950 a andthe second detector sub-module 950 c and fastening the bolt by a nut.The first detector sub-module 950 a may include a boss. The seconddetector sub-module 950 c may include a recessed pocket. The recessedpocket of the second detector sub-module 950 cmay receive the boss ofthe first detector sub-module 950 a. The bolt 910 may pass through boththe boss and the recessed pocket. The plurality of threaded fasteners930 may be used to assemble the anti-scatter grid 901 at the top of thefirst detector sub-module 950 a and the second detector sub-module 950c.

This description is intended to be illustrative, and not to limit thescope of the present disclosure. Many alternatives, modifications, andvariations will be apparent to those skilled in the art. The features,structures, methods, and other characteristics of the exemplaryembodiments described herein may be combined in various ways to obtainadditional and/or alternative exemplary embodiments. For example, thefirst detector sub-module 950 a may be connected to the anti-scattergrid 901 by a glue layer, a rivet, or the like, or a combinationthereof. However, those variations and modifications do not depart thescope of the present disclosure.

It shall be noted that any other number of detector sub-modules may beassembled in a detector module. For example, as shown in FIG. 10, adetector module 1000 may include an anti-scatter grid 1001, a bolt 1010,a plurality of threaded fasteners 1030, a first detector sub-module 1050a, a second detector sub-module 1050 b, a third detector sub-module 1050b′, and a fourth detector sub-module 1050 c. Each of these detectorsub-modules may include a frame 1004, a plurality of heat transfer fins1005, a plurality of signal transmission boards 1002, and a dataacquisition circuitry 1003.

Similar to the description of FIG. 9, the detector module 1000 may beassembled by inserting the bolt 1010 through the first detectorsub-module 1050 a, the second detector sub-module 1050 b, the thirddetector sub-module 1050 b′, and the fourth detector sub-module 1050 c.A pair of adjacent detector sub-modules, such as the first detectorsub-module 1050 a and the second detector sub-module 1050 b, may bealigned via a boss on the first detector sub-module 1050 a received in arecessed pocket on the second detector-sub module 1050 b. The seconddetector sub-module 1050 b may further include a boss on the side facingthe third detector sub-module 1050 c such that the boss on the seconddetector sub-module 1050 b may be received by the recessed pocket on thethird detector sub-module 1050 c.

This description is intended to be illustrative, and not to limit thescope of the present disclosure. Many alternatives, modifications, andvariations will be apparent to those skilled in the art. The features,structures, methods, and other characteristics of the exemplaryembodiments described herein may be combined in various ways to obtainadditional and/or alternative exemplary embodiments. For example, theanti-scatter grid 1001 may be attached on the detector sub-modules via aglue layer, a rivet, or the like, or a combination thereof. However,those variations and modifications do not depart the scope of thepresent disclosure.

FIGS. 11A and 11B illustrate an exemplary detector sub-module 1100according to some embodiments of the present disclosure. As shown, thedetector sub-module 1100 may include an anti-scatter grid 1101, aplurality of signal transmission boards 1102, a data acquisitioncircuitry 1103, a frame 1104, a plurality of heat transfer fins 1105,and a pin hole 1107.

As shown, the anti-scatter grid 1101 may be disposed at the top of theframe 1104. The pin hole 1107 may be configured to facilitate theassembly of the anti-scatter grid 1101 with the frame 1104. Theplurality of signal transmission boards 1102 may be disposed on the dataacquisition circuitry 1103. The data acquisition circuitry 1103 may beattached to the columnar part of the frame 1104. The plurality of heattransfer fins 1105 and the data acquisition circuitry 1103 may bedisposed on opposite sides of the frame 1104. Heat generated by the dataacquisition circuitry 1103 may be dissipated via the heat transfer fins1105.

This description is intended to be illustrative, and not to limit thescope of the present disclosure. Many alternatives, modifications, andvariations will be apparent to those skilled in the art. The features,structures, methods, and other characteristics of the exemplaryembodiments described herein may be combined in various ways to obtainadditional and/or alternative exemplary embodiments. For example, theframe 1104 and the plurality of heat transfer fins 1105 may bemanufactured together as a one-piece or integral component, or theplurality of heat transfer fins 1105 may be inserted into one or moreslots in the frame 1104. However, those variations and modifications donot depart the scope of the present disclosure.

FIGS. 12A and 12B illustrate an exemplary detector sub-module 1200according to some embodiments of the present disclosure. As shown, thedetector sub-module 1200 may include a plurality of signal transmissionboards 1202 a and 1202 b, a data acquisition circuitry 1203, a frame1204, a plurality of heat transfer fins 1205, a detection layer 1206,and a pin hole 1207.

In some embodiments, the detection layer 1206 may be disposed at the topof the frame 1204. The detection layer 1206 may include a plurality ofgroups of pixels. A group of pixels may include a plurality of pixelsarranged within a certain region (e.g., a rectangular region as shown inFIG. 12A). The groups of pixels may be arranged in different rows (e.g.,two rows with 8 groups of pixels in each row as shown in FIG. 12A). Thedetection layer 1206 may be electrically connected with the plurality ofsignal transmission boards 1202 a and 1202 b. The plurality of signaltransmission boards 1202 a and 1202 b may be electrically connected withthe data acquisition circuitry 1203. The plurality of heat transfer fins1205 and the data acquisition circuitry 1203 may be disposed on oppositesides of the frame 1204. The plurality of signal transmission boards1202 a may be thermally connected with the data acquisition circuitry1203.

In some embodiments, the length of the plurality of heat transfer fins1205 (i.e., l₂) may be the same as the length of the frame 1204. In someembodiments, the length of at least one of the plurality of heattransfer fins may be different from (e.g., shorter or longer) than thelength of the frame 1204. In some embodiments, the width of theplurality of heat transfer fins 1205 (i.e., w₃) may be the same ordifferent. The width w₃ may be configured such that the outermost edgeof the fin is aligned to the edge of the frame 1204, or may be shorter.

In some embodiments, the frame 1204 and the plurality of heat transferfins 1205 may be manufactured as a one-piece component. The plurality ofheat transfer fins 1205 may be manufactured using a single material. Asanother example, the plurality of heat transfer fins 1205 may bemanufactured as separate components made of the same material ordifferent materials. Separate heat transfer fins 1205 may be mounted tothe frame 1204 as part of an installation process.

The signal transmission board 1202 a may include any suitable number ofsignal transmission boards. The number of signal transmission boards1202 a may be the same as or different from the number of signaltransmission boards 1202 b. Merely by way of example, a signaltransmission board 1202 a may be connected to a signal transmissionboard 1202 b. As another example, at least two signal transmissionboards 1202 a may be connected to a same signal transmission board 1202b.

In some embodiments, the plurality of heat transfer fins 1205 may beparallel to each other. The angle formed by the columnar part of theframe 1204 and each of the plurality of heat transfer fins 1205 may bein a range of 45 degrees to 90 degrees. The interspace d may be of anysuitable value. Merely by way of example, the interspace d between twoadjacent heat transfer fins may be in the range of about 0.5 cm to about4 cm.

FIGS. 13A and 13B illustrate an exemplary detector sub-module 1300according to some embodiments of the present disclosure. As shown, thedetector sub-module 1300 may include a plurality of signal transmissionboards 1302 a and 1302 b, a frame 1304, a plurality of heat transferfins 1305 a and 1305 b, a data acquisition circuitry 1303 a, a dataacquisition circuitry 1303 b, and a detection layer 1306.

The detection layer 1306 may be disposed at the top of the frame 1304.The plurality of signal transmission boards 1302 a and 1302 b may bedisposed on opposite sides of the columnar part of the frame 1304. Thedata acquisition circuitry 1303 a and the data acquisition circuitry1303 b may be disposed on opposite sides of the columnar part of theframe 1304. The plurality of heat transfer fins 1305 a and 1305 b may bedisposed opposite sides of the columnar part of the frame 1204. Theplurality of heat transfer fins 1305 b may be disposed so as to bethermally connected with the data acquisition circuitry 1303 a. The dataacquisition circuitry 1303 a may be electrically connected with thesignal transmission board 1302 a. The plurality of heat transfer fins1305 a may be disposed so as to be thermally connected with the dataacquisition circuitry 1303 b. The data acquisition circuitry 1303 b maybe electrically connected with the signal transmission board 1302 b.

The detection layer 1306 (not shown in FIG. 13B) may be electricallyconnected with the plurality of signal transmission boards 1302 b. Theplurality of signal transmission boards 1302 b may be configured totransmit signals from the detection layer 1306 to the data acquisitioncircuitry 1303 b. The data acquisition circuitry 1303 b may beconfigured to process the signals received from the plurality of signaltransmission boards 1302 b. The processing may produce a considerableamount of heat. The plurality of heat transfer fins 1305 b may beconfigured to dissipate the heat produced by the data acquisitioncircuitry 1303 b.

In some embodiments, the number of the signal transmission boards 1302 amay be the same as or different from the number of the signaltransmission boards 1302 b.

FIG. 14 is a perspective view of a portion of a detection layerconnecting to a signal transmission board according to some embodimentsof the present disclosure. As shown, each of two groups of pixels 1406 aand 1406 b may present a matrix form of pixels. The two groups of pixels1406 a and 1406 b may be electrically connected with a same signaltransmission board 1402. The signal transmission board 1402 may befurther connected to a data acquisition circuitry to process the dataacquired through the two groups of pixels 1406 a and 1406 b.

This description is intended to be illustrative, and not to limit thescope of the present disclosure. Many alternatives, modifications, andvariations will be apparent to those skilled in the art. The features,structures, methods, and other characteristics of the exemplaryembodiments described herein may be combined in various ways to obtainadditional and/or alternative exemplary embodiments. For example, threeor more groups of pixels may be connected to a same signal transmissionboard. However, those variations and modifications do not depart thescope of the present disclosure.

It should be noted that the above description of the embodiments areprovided for the purposes of comprehending the present disclosure, andnot intended to limit the scope of the present disclosure. For personshaving ordinary skills in the art, various variations and modificationsmay be conducted in the light of the present disclosure. However, thosevariations and the modifications do not depart from the scope of thepresent disclosure.

Having thus described the basic concepts, it may be rather apparent tothose skilled in the art after reading this detailed disclosure that theforegoing detailed disclosure is intended to be presented by way ofexample only and is not limiting. Various alterations, improvements, andmodifications may occur and are intended to those skilled in the art,though not expressly stated herein. These alterations, improvements, andmodifications are intended to be suggested by this disclosure, and arewithin the spirit and scope of the exemplary embodiments of thisdisclosure.

Moreover, certain terminology has been used to describe embodiments ofthe present disclosure. For example, the terms “one embodiment,” “anembodiment,” and/or “some embodiments” mean that a particular feature,structure or characteristic described in connection with the embodimentis included in at least one embodiment of the present disclosure.Therefore, it is emphasized and should be appreciated that two or morereferences to “an embodiment” or “one embodiment” or “an alternativeembodiment” in various portions of this specification are notnecessarily all referring to the same embodiment. Furthermore, theparticular features, structures or characteristics may be combined assuitable in one or more embodiments of the present disclosure.

Further, it will be appreciated by one skilled in the art, aspects ofthe present disclosure may be illustrated and described herein in any ofa number of patentable classes or context including any new and usefulprocess, machine, manufacture, or composition of matter, or any new anduseful improvement thereof. Accordingly, aspects of the presentdisclosure may be implemented entirely hardware, entirely software(including firmware, resident software, micro-code, etc.) or combiningsoftware and hardware implementation that may all generally be referredto herein as a “block,” “module,” “engine,” “unit,” “component,” or“system.” Furthermore, aspects of the present disclosure may take theform of a computer program product embodied in one or more computerreadable media having computer readable program code embodied thereon.

A computer readable signal medium may include a propagated data signalwith computer readable program code embodied therein, for example, inbaseband or as part of a frame wave. Such a propagated signal may takeany of a variety of forms, including electro-magnetic, optical, or thelike, or any suitable combination thereof. A computer readable signalmedium may be any computer readable medium that is not a computerreadable storage medium and that may communicate, propagate, ortransport a program for use by or in connection with an instructionexecution system, apparatus, or device. Program code embodied on acomputer readable signal medium may be transmitted using any appropriatemedium, including wireless, wireline, optical fiber cable, RF, or thelike, or any suitable combination of the foregoing.

Computer program code for carrying out operations for aspects of thepresent disclosure may be written in any combination of one or moreprogramming languages, including an object-oriented programming languagesuch as Java, Scala, Smalltalk, Eiffel, JADE, Emerald, C++, C#, VB. NET,Python or the like, conventional procedural programming languages, suchas the “C” programming language, Visual Basic, Fortran 2008, Perl, COBOL2002, PHP, ABAP, dynamic programming languages such as Python, Ruby andGroovy, or other programming languages. The program code may executeentirely on the user's computer, partly on the user's computer, as astand-alone software package, partly on the user's computer and partlyon a remote computer or entirely on the remote computer or server. Inthe latter scenario, the remote computer may be connected to the user'scomputer through any type of network, including a local area network(LAN) or a wide area network (WAN), or the connection may be made to anexternal computer (for example, through the Internet using an InternetService Provider) or in a cloud computing environment or offered as aservice such as a Software as a Service (SaaS).

Furthermore, the recited order of processing elements or sequences, orthe use of numbers, letters, or other designations therefore, is notintended to limit the claimed processes and methods to any order exceptas may be specified in the claims. Although the above disclosurediscusses through various examples what is currently considered to be avariety of useful embodiments of the disclosure, it is to be understoodthat such detail is solely for that purpose, and that the appendedclaims are not limited to the disclosed embodiments, but, on thecontrary, are intended to cover modifications and equivalentarrangements that are within the spirit and scope of the disclosedembodiments. For example, although the implementation of variouscomponents described above may be embodied in a hardware device, it mayalso be implemented as a software only solution—e.g., an installation onan existing server or mobile device.

Similarly, it should be appreciated that in the foregoing description ofembodiments of the present disclosure, various features are sometimesgrouped together in a single embodiment, figure, or description thereoffor the purpose of streamlining the disclosure aiding in theunderstanding of one or more of the various inventive embodiments. Thismethod of disclosure, however, is not to be interpreted as reflecting anintention that the claimed subject matter requires more features thanare expressly recited in each claim. Rather, inventive embodiments liein less than all features of a single foregoing disclosed embodiment.

In some embodiments, the numbers expressing quantities of ingredients,properties, and so forth, used to describe and claim certain embodimentsof the application are to be understood as being modified in someinstances by the term “about,” “approximate,” or “substantially.” Forexample, “about,” “approximate,” or “substantially” may indicate ±20%variation of the value it describes, unless otherwise stated.Accordingly, in some embodiments, the numerical parameters set forth inthe written description and attached claims are approximations that mayvary depending upon the desired properties sought to be obtained by aparticular embodiment. In some embodiments, the numerical parametersshould be construed in light of the number of reported significantdigits and by applying ordinary rounding techniques. Notwithstandingthat the numerical ranges and parameters setting forth the broad scopeof some embodiments of the application are approximations, the numericalvalues set forth in the specific examples are reported as precisely aspracticable.

Each of the patents, patent applications, publications of patentapplications, and other material, such as articles, books,specifications, publications, documents, things, and/or the like,referenced herein is hereby incorporated herein by this reference in itsentirety for all purposes, excepting any prosecution file historyassociated with same, any of same that is inconsistent with or inconflict with the present document, or any of same that may have alimiting affect as to the broadest scope of the claims now or laterassociated with the present document. By way of example, should there beany inconsistency or conflict between the description, definition,and/or the use of a term associated with any of the incorporatedmaterial and that associated with the present document, the description,definition, and/or the use of the term in the present document shallprevail.

It is to be understood that the embodiments of the application disclosedherein are illustrative of the principles of the embodiments of theapplication. Other modifications that may be employed may be within thescope of the application. Thus, by way of example, but not oflimitation, alternative configurations of the embodiments of theapplication may be utilized in accordance with the teachings herein.Accordingly, embodiments of the present application are not limited tothat precisely as shown and described.

In closing, it is to be understood that the embodiments of theapplication disclosed herein are illustrative of the principles of theembodiments of the application. Other modifications that may be employedmay be within the scope of the application. Thus, by way of example, butnot of limitation, alternative configurations of the embodiments of theapplication may be utilized in accordance with the teachings herein.Accordingly, embodiments of the present application are not limited tothat precisely as shown and describe.

What is claimed is:
 1. A detector module comprising: a plurality of detector sub-modules including a first detector sub-module and a second detector sub-module adjacent to the first detector sub-module, the plurality of detector sub-modules being detachably assembled, wherein the first detector sub-module comprises a first positioning element, and the second detector sub-module comprises a second positioning element, wherein each of the plurality of detector sub-modules comprises: a detection layer configured to detect radiation; at least one data acquisition circuitry electrically connected with the detection layer, the at least one data acquisition circuitry being configured to process an electrical signal in response to the radiation detected by the detection layer; a frame for supporting the detection layer and the at least one data acquisition circuitry; and wherein the first positioning element and the second positioning element form a mating connection.
 2. The detector module of claim 1, wherein the first positioning element of the first detector sub-module comprises a boss disposed on a first side of the first detector sub-module, the second positioning element of the second detector sub-module comprises a recessed pocket disposed on a second side of the second detector sub-module, and the second side of the second detector sub-module is situated to face the first side of the first detector sub-module.
 3. The detector module of claim 2, wherein the plurality of detector sub-modules are assembled based on a bolt inserted through the boss and the recessed pocket.
 4. The detector module of claim 1, wherein a detector sub-module of the plurality of detector sub-modules further comprises a plurality of fins thermally connected with the at least one data acquisition circuitry of the detector sub-module.
 5. The detector module of claim 4, wherein the plurality of fins of the detector sub-module are disposed on a third side of the frame, and the data acquisition circuitry is disposed on a fourth side of the frame, the fourth side being opposite to the third side.
 6. The detector module of claim 5, wherein the at least one data acquisition circuitry is electrically connected with two signal transmission boards disposed on opposite sides of the frame, and the two signal transmission boards are electrically connected to the detection layer of the detector sub-module.
 7. The detector module of claim 5, wherein the at least one data acquisition circuitry is electrically connected with a signal transmission board disposed on a same side of the frame as the at least one data acquisition circuitry.
 8. The detector module of claim 4, wherein the plurality of fins are disposed on opposite sides of the frame.
 9. The detector module of claim 8, wherein the detector sub-module comprises two data acquisition circuitries disposed on opposite sides of the frame of the detector sub-module.
 10. The detector module of claim 9, wherein the detector sub-module comprises two signal transmission boards disposed on opposite sides of the frame, each of the two signal transmission boards is electrically connected with one of the two data acquisition circuitries.
 11. The detector module of claim 1, wherein the frame is configured to support an anti-scatter grid disposed on a top of the detection layer.
 12. A detector module, comprising: a frame; a detection layer supported by the frame and configured to detect radiation; at least one data acquisition circuitry electrically connected with the detection layer, the at least one data acquisition circuitry being configured to process an electrical signal in response to the radiation detected by the detection layer; and a heat dissipation structure coupled to the frame, wherein the heat dissipation structure comprises a plurality of fins thermally coupled with the at least one data acquisition circuitry.
 13. The detector module of claim 12, wherein the plurality of fins are disposed on a first side of the frame, and the at least one data acquisition circuitry is disposed on a second side of the frame, the first side being opposite to the second side.
 14. The detector module of claim 13, wherein the at least one data acquisition circuitry is electrically connected with a first signal transmission board disposed on a same side of the frame as the at least one data acquisition circuitry, and the first signal transmission board is electrically connected to the detection layer of the detector module.
 15. The detector module of claim 14, wherein the at least one data acquisition circuitry is electrically connected with a second signal transmission board disposed on a same side of the frame as the plurality of fins, and the second signal transmission board is electrically connected to the detection layer of the detector module.
 16. The detector module of claim 12, wherein a first portion of the plurality of fins are disposed on a third side of the frame, a second portion of the plurality of fins are disposed on a fourth side of the frame, and the third side is opposite to the fourth side.
 17. The detector module of claim 16, wherein the at least one data acquisition circuitry is disposed on the third side or the fourth side of the frame.
 18. The detector module of claim 16, wherein the at least one data acquisition circuitry comprises a first data acquisition circuitry and a second data acquisition circuitry, the first data acquisition circuitry is disposed on the third side of the frame, and the second data acquisition circuitry is disposed on the fourth side of the frame.
 19. The detector module of claim 18, wherein the first data acquisition circuitry is electrically connected with a third signal transmission board disposed on a same side of the frame as the first data acquisition circuitry, and the second data acquisition circuitry is electrically connected with a fourth signal transmission board disposed on a same side of the frame as the second data acquisition circuitry.
 20. The detector module of claim 12, further comprising: a recessed pocket disposed on the frame, wherein the recessed pocket is configured to receive a boss of another detector module to assemble the detector module and the other detector module. 